FAIR-RITE 2506031027Y0 Datasheet & Stock

The 2506031027Y0 is a multi-layer Chip Bead to suppress conducted EMI signals. Chip beads can be used in an array of devices such as cellular phones, computers, laptops, pagers, etc. The small package sizes accommodate automated placements and allow for a dense packaging of circuit boards. Chip beads are 100% tested for impedance and DC resistance. They are available in standard, high and GHz signal speeds. The multi-layer chip beads are organized by increasing package size and current carrying capacity.




Chip Beads are Measured for Impedance on HP 4291A and Fixture HP 16192A

Chip Beads have plated contacts, 100% Tin over Nickel undercoating

Suggested Land Patterns are in Accordance to the Latest Revision of IPC-7351

-55°C to 125°C Recommended Storage and Operating Temperature Range

0603 Package Size





Applications


Industrial





Warnings
Market demand for this product has caused an extension in leadtimes. Delivery dates may fluctuate. Product exempt from discounts.