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3M 662XW05MIC5DISC Diamond Lapping Film
3M’s Diamond Lapping Film - Type H (662XW) is engineered for demanding radiusing and leveling operations. This film boasts a thicker diamond coating, a higher diamond concentration, and a tougher resin compared to standard diamond lapping films, resulting in a significantly increased cut rate and extended lifespan. It’s a reliable choice for applications where durability and consistent performance are paramount, contributing to efficient and cost-effective polishing processes. Suitable for a wide range of connector types, this film helps achieve precise surface finishes and connector geometries.
3M 662XW05MIC5DISC Diamond Lapping Film Specifications:
- Mineral Type: Diamond
- Micron Grade: 0.5
- Backing Material: Polyester Film
- Diameter: 5"
- Application: Radiusing and Leveling
- Durability: 2 to 3 times longer than standard DLF
- PSA: Available with or without Pressure Sensitive Adhesive (PSA) backing
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Frequently Asked Questions
Where can I buy 3M 662XW05MIC5DISC?
You can click on the BUY or RFQ button to purchase 662XW05MIC5DISC from an authorized 3M distributor.
How do I troubleshoot issues or seek technical support for part 662XW05MIC5DISC?
You can download the 662XW05MIC5DISC datasheet or visit the 3M website for support.
Who is the manufacturer of 662XW05MIC5DISC?
3M