3M DP270BLACK400ML Epoxy Potting Compound Adhesive 3M Scotch-Weld DP270 is a versatile two-part epoxy potting compound and adhesive. Primarily used for potting, sealing, and encapsulating electronic components, it provides excellent thermal shock resistance, good electrical insulation, and is noncorrosive to copper. It's suitable for applications like potting transformers, coils, chokes, relays, and protecting heat-sensitive components like glass diodes and sensors. Available in bulk containers or the 3M EPX Applicator System for multi-station usage.
3M DP270BLACK400ML Epoxy Potting Compound Adhesive Specifications: product_description: Two-part, low viscosity epoxy resin system for potting, sealing, and encapsulation of electronic components. Available in clear or black. features: Good thermal shock resistance, excellent electrical properties, meets UL 94 HB, noncorrosive to copper, long worklife, negligible exotherm. color: Clear or Black base_resin: Epoxy/amine mix_ratio: 1:1 by volume (1:0.85 B:A by weight) net_weight_lbs_gal_base: 9.6 - 9.7 net_weight_lbs_gal_accelerator: 8.0 - 8.2 worklife: 60-70 minutes @ 23°C (73°F) viscosity_cps_base: 7000 - 16,000 @ 23°C (73°F) viscosity_cps_accelerator: 6000 - 12,000 @ 23°C (73°F) tack_free_time: Approx. 3 hours @ 23°C (73°F) cure_time: 48 hours @ 73°F (23°C) ul_rating: 94 HB (File No. E61941) weight_loss_tga_1_percent: 122°C (252°F) weight_loss_tga_5_percent: 175°C (347°F) weight_loss_tga_10_percent: 210°C (410°F) thermal_coefficient_expansion_below_tg: 80 x 10^-6 units/unit/°C thermal_coefficient_expansion_above_tg: 180 x 10^-6 units/unit/°C glass_transition_temperature_onset: 43°C (109°F) glass_transition_temperature_midpoint: 49°C (120°F) thermal_conductivity_btu_ft_hr_f: 0.103 thermal_conductivity_cal_sec_cm_c: 0.426 x 10^3 thermal_conductivity_watt_m_c: 0.177 thermal_shock_resistance: Pass 5 cycles without cracking (Olyphant Test) dielectric_constant_1_khz: 3.5 @ 23°C (73°F) dissipation_factor_1_khz: 0.018 @ 23°C (73°F) dielectric_strength: 850 volts/mil volume_resistivity: 4.1 x 10^14 ohm-cm insulation_resistance_initial: 3 x 10^13 ohms insulation_resistance_1000_hrs: 2 x 10^11 ohms corrosion_test_35c: Pass - No copper corrosion solvent_resistance_acetone: B C solvent_resistance_isopropyl_alcohol: A B solvent_resistance_freon_tf: A A solvent_resistance_freon_tmc: B C solvent_resistance_rma_flux: A B overlap_shear_adhesion_aluminum_aluminum_etched_neg_67f: 1200-1250 psi overlap_shear_adhesion_aluminum_aluminum_etched_73f: 2450-2500 psi overlap_shear_adhesion_fr4_fr4_73f: 1750-1800 psi overlap_shear_adhesion_copper_copper_73f: 1700-1750 psi t_peel_adhesion_aluminum_aluminum_etched: < 2 piw compression_strength: 8100 psi Buy the DP-270 BLACK 400ML 3M Epoxy Potting Compound Adhesive | myMectronic Securely purchase 3M DP-270 BLACK 400ML Epoxy Potting Compound Adhesive for your industrial needs.
Buy Now Frequently Asked Questions Where can I buy 3M DP270BLACK400ML? You can click on the BUY or RFQ button to purchase DP270BLACK400ML from an authorized 3M distributor.
How do I troubleshoot issues or seek technical support for part DP270BLACK400ML? You can download the DP270BLACK400ML datasheet or visit the 3M website for support.
Who is the manufacturer of DP270BLACK400ML? 3M
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