myMectronic
myMectronic

A Premier B2B Part Search

3M DP270BLACK400ML Epoxy Potting Compound Adhesive

3M Scotch-Weld DP270 is a versatile two-part epoxy potting compound and adhesive. Primarily used for potting, sealing, and encapsulating electronic components, it provides excellent thermal shock resistance, good electrical insulation, and is noncorrosive to copper. It's suitable for applications like potting transformers, coils, chokes, relays, and protecting heat-sensitive components like glass diodes and sensors. Available in bulk containers or the 3M EPX Applicator System for multi-station usage.

3M DP270BLACK400ML Epoxy Potting Compound Adhesive Specifications:

  • product_description: Two-part, low viscosity epoxy resin system for potting, sealing, and encapsulation of electronic components. Available in clear or black.
  • features: Good thermal shock resistance, excellent electrical properties, meets UL 94 HB, noncorrosive to copper, long worklife, negligible exotherm.
  • color: Clear or Black
  • base_resin: Epoxy/amine
  • mix_ratio: 1:1 by volume (1:0.85 B:A by weight)
  • net_weight_lbs_gal_base: 9.6 - 9.7
  • net_weight_lbs_gal_accelerator: 8.0 - 8.2
  • worklife: 60-70 minutes @ 23°C (73°F)
  • viscosity_cps_base: 7000 - 16,000 @ 23°C (73°F)
  • viscosity_cps_accelerator: 6000 - 12,000 @ 23°C (73°F)
  • tack_free_time: Approx. 3 hours @ 23°C (73°F)
  • cure_time: 48 hours @ 73°F (23°C)
  • ul_rating: 94 HB (File No. E61941)
  • weight_loss_tga_1_percent: 122°C (252°F)
  • weight_loss_tga_5_percent: 175°C (347°F)
  • weight_loss_tga_10_percent: 210°C (410°F)
  • thermal_coefficient_expansion_below_tg: 80 x 10^-6 units/unit/°C
  • thermal_coefficient_expansion_above_tg: 180 x 10^-6 units/unit/°C
  • glass_transition_temperature_onset: 43°C (109°F)
  • glass_transition_temperature_midpoint: 49°C (120°F)
  • thermal_conductivity_btu_ft_hr_f: 0.103
  • thermal_conductivity_cal_sec_cm_c: 0.426 x 10^3
  • thermal_conductivity_watt_m_c: 0.177
  • thermal_shock_resistance: Pass 5 cycles without cracking (Olyphant Test)
  • dielectric_constant_1_khz: 3.5 @ 23°C (73°F)
  • dissipation_factor_1_khz: 0.018 @ 23°C (73°F)
  • dielectric_strength: 850 volts/mil
  • volume_resistivity: 4.1 x 10^14 ohm-cm
  • insulation_resistance_initial: 3 x 10^13 ohms
  • insulation_resistance_1000_hrs: 2 x 10^11 ohms
  • corrosion_test_35c: Pass - No copper corrosion
  • solvent_resistance_acetone: B C
  • solvent_resistance_isopropyl_alcohol: A B
  • solvent_resistance_freon_tf: A A
  • solvent_resistance_freon_tmc: B C
  • solvent_resistance_rma_flux: A B
  • overlap_shear_adhesion_aluminum_aluminum_etched_neg_67f: 1200-1250 psi
  • overlap_shear_adhesion_aluminum_aluminum_etched_73f: 2450-2500 psi
  • overlap_shear_adhesion_fr4_fr4_73f: 1750-1800 psi
  • overlap_shear_adhesion_copper_copper_73f: 1700-1750 psi
  • t_peel_adhesion_aluminum_aluminum_etched: < 2 piw
  • compression_strength: 8100 psi

Buy the DP-270 BLACK 400ML 3M Epoxy Potting Compound Adhesive | myMectronic

Securely purchase 3M DP-270 BLACK 400ML Epoxy Potting Compound Adhesive for your industrial needs.

Buy Now

Frequently Asked Questions

Where can I buy 3M DP270BLACK400ML?

You can click on the BUY or RFQ button to purchase DP270BLACK400ML from an authorized 3M distributor.

How do I troubleshoot issues or seek technical support for part DP270BLACK400ML?

You can download the DP270BLACK400ML datasheet or visit the 3M website for support.

Who is the manufacturer of DP270BLACK400ML?

3M

Part List

Browse and search other parts, locate datasheets and stock