ABL's BGAPP035 is a high-performance thermal interface pad designed for effective heat sink attachment to MPU, chipsets, and plastic-encapsulated components. Featuring excellent thermal conductivity of 0.95 W/m·K, this white aluminium-backed pad provides superior cushioning and gap filling properties for optimal heat dissipation. The adhesive system, comprising a 0.10 mm aluminium foil backing and 0.075 mm acrylic adhesive, offers high-temperature resistance, enabling secure attachment even to vertical surfaces and metal enclosures. The total thickness is 0.27 mm, ensuring reliable thermal management for electronic assemblies.
Experience reliable thermal management with the ABL BGAPP035 thermal interface pad, designed for heat sink attachment to MPU and chipsets. Featuring a high thermal conductivity of 0.95 W/m·K, this 0.27 mm thick pad offers superior gap filling and cushioning. The aluminium foil backing and acrylic adhesive provide excellent high-temperature resistance, making it suitable for attaching components to vertical heatsinks and metal enclosures. Easy to install with supplied thermal tape, ensuring optimal performance in electronic assemblies.
You can click on the BUY or RFQ button to purchase BGAPP035 from an authorized ABL Aluminium Components distributor.
You can download the BGAPP035 datasheet or visit the ABL Aluminium Components website for support.
ABL Aluminium Components