AMP - TE CONNECTIVITY 5749081-1 Datasheet & Stock

The Series III series IDC D-sub Connectors offers a high-density D type interface and a solder-less board-mount interconnection. Choice of configurations includes headers with rails and latch blocks, with latch blocks only and without rails and latch blocks. It headers with ACTION PIN contacts are compatible with SCSI-2, SCSI-3, EIA RS-232, IPI-2 and HIPPI standards. The diameter of the hole is smaller than the diagonal size of the pin. The beam characteristics of the pin are designed so that a plastic, as well as elastic, deformation takes place during insertion. The two spring members compress to different degrees to accommodate hole tolerances. The compliant pin also reduces strain on the board. With a rigid pin, the elastic strain energy is stored entirely in the board, leading to damage of the plated through holes. The residual force of the elastic deformation maintains stored energy to produce a gas-tight contact zone between the pin and the plated-through-hole.




Available in 20, 26, 50, 68 and 100 contact sizes

UL94V-0 Flammability





Applications


Communications & Networking,

Computers & Computer Peripherals,

Industrial