AMP - TE CONNECTIVITY 8134-HC-8P2 Datasheet & Stock

The HOLTITE series zero profile Solder less DIP Socket designed to be press-fit into the plated through-hole of a printed wiring board. This unique design allows the plated-thru hole to become the component socket. The outer conical shape of the Holtite® contact sizes the plated-thru hole when pressed into place. The precision-machined geometry allows for the controlled displacement of plated material without damaging the hole or affecting the normal mechanical and electrical contact performance. The socketing technique provides the shortest distance between the component seating plane and the contact engagement zone for maximum retention of short component leads. Open contact design permits air flow through the board, increasing heat dissipation and extending component life. Use of the Holtite® solder less system removes certain artwork restrictions necessary for wave soldering and solder joint construction.




Lowest socket profile

Precision-machined, tapered-entry, four finger contact

Retains minimum component lead lengths

Solder less, gas-tight, press-fit insertion

Immediate conversion to the Holtite® system

10mΩ Maximum contact resistance





Applications


Industrial,

Defence, Military & Aerospace