This is a high-performance BGA heat sink with dimensions of 25.0 x 25.0 x 17.5 mm, featuring anodized aluminum construction. It includes a heat sink clip for secure attachment and is compatible with maxiFLOW and maxiGRIP-STD mounting systems, providing effective thermal management for electronic components.
You can click on the BUY or RFQ button to purchase ATS52250PC1R0 from an authorized Advanced Thermal Solutions distributor.
You can download the ATS52250PC1R0 datasheet or visit the Advanced Thermal Solutions website for support.
Advanced Thermal Solutions