This high-performance BGA heat sink measures 37.5 x 37.5 x 17.5 mm and features maxiFLOW and maxiGRIP-STD technology. It is made from anodized aluminum and includes a heat sink clip for secure attachment, providing efficient thermal management for electronic components.
You can click on the BUY or RFQ button to purchase ATS52375PC1R0 from an authorized Advanced Thermal Solutions distributor.
You can download the ATS52375PC1R0 datasheet or visit the Advanced Thermal Solutions website for support.
Advanced Thermal Solutions