This is a high-performance BGA heat sink measuring 15.0 x 15.0 x 9.5 mm. It features a cross-cut design and is attached using adhesive thermal tape for efficient heat dissipation. Made from aluminum with a black anodized finish, it is designed to improve cooling in electronic assemblies.
You can click on the BUY or RFQ button to purchase ATS55170DC1R0 from an authorized Advanced Thermal Solutions distributor.
You can download the ATS55170DC1R0 datasheet or visit the Advanced Thermal Solutions website for support.
Advanced Thermal Solutions