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ARIES ELECTRONICS 0835000011RC SOIC to DIP Adapter
The Aries Electronics 08-350000-11-RC SOIC-to-DIP adapter provides a cost-effective solution for upgrading to SOIC components without the need to change existing PCB layouts. Constructed with a 0.062 inch thick FR-4 board and finished with ENIG pads, this adapter ensures reliable connectivity. It's ideal for engineers and technicians looking to modernize their designs while minimizing disruption. Customization options are available for specific material, plating, size, and configuration needs, making it a versatile choice for various industrial applications.
ARIES ELECTRONICS 0835000011RC SOIC to DIP Adapter Specifications:
- BOARD MATERIAL: 0.062 [1.58] thick FR-4 or IS410 per IPC4101A/26
- PADS: Finished with ENIG (Immersion Au over Electroless Ni)
- PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00
- PIN PLATING: 10µ [2.54µ] min. Au per MIL-G-45204 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290
- OPERATING TEMPERATURE: 105°C max.
- SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
- DIM B: 0.460[11.68]
- CENTERS C: 0.300[7.62]
- DIM E: 0.455[11.56]
- DIM F: 0.155[3.94]
- DIM G: 0.150[3.81]
- DIM H: 0.121[3.07]
- Pins: 8
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Frequently Asked Questions
Where can I buy ARIES ELECTRONICS 0835000011RC?
You can click on the BUY or RFQ button to purchase 0835000011RC from an authorized ARIES ELECTRONICS distributor.
How do I troubleshoot issues or seek technical support for part 0835000011RC?
You can download the 0835000011RC datasheet or visit the ARIES ELECTRONICS website for support.
Who is the manufacturer of 0835000011RC?
ARIES ELECTRONICS