A low-profile Dual In-line Package (DIP) component designed for space-saving electronic applications. Suitable for use in compact circuit board assemblies where height clearance is limited. Ideal for general-purpose electronic connections and integrating multiple components in a small footprint.
You can click on the BUY or RFQ button to purchase SDA12H1BD from an authorized C&K COMPONENTS distributor.
You can download the SDA12H1BD datasheet or visit the C&K COMPONENTS website for support.
C&K COMPONENTS