CTS CORP's APF series forged heat sinks are designed for high-power applications, utilizing precision forging technology to ensure optimal heat dissipation. These heat sinks are ideal for BGA and other surface mount packages, offering versatility with various mounting methods and fin heights. Their design eliminates the need for special tools during assembly and avoids the requirement for additional holes on the PCB, simplifying integration and reducing manufacturing costs. The adhesive attachment method provides a secure and efficient thermal solution for a wide range of electronic devices.
You can click on the BUY or RFQ button to purchase APF191910CBA01 from an authorized CTS Corporation distributor.
You can download the APF191910CBA01 datasheet or visit the CTS Corporation website for support.
CTS Corporation