CTS CORP's APF series forged heat sinks are engineered for high-performance applications requiring efficient heat dissipation. The precision forging process ensures consistent quality and structural integrity. Designed for BGA and other surface mount packages, these heat sinks offer flexibility in mounting options and fin heights to optimize thermal performance. Their design eliminates the need for special tools or additional holes on the PCB, simplifying the assembly process and reducing manufacturing costs. Ideal for electronics requiring robust and reliable cooling solutions.
You can click on the BUY or RFQ button to purchase APF191913CBA01 from an authorized CTS Corporation distributor.
You can download the APF191913CBA01 datasheet or visit the CTS Corporation website for support.
CTS Corporation