A passive heat sink designed for BGA pin array applications, made from aluminum alloy 6063 with black anodized finish. It provides efficient thermal management with a thermal resistance of 5.3°C/W, making it suitable for dissipating heat from electronic components.
You can click on the BUY or RFQ button to purchase APR272712CBA01 from an authorized CTS Corporation distributor.
You can download the APR272712CBA01 datasheet or visit the CTS Corporation website for support.
CTS Corporation