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CTS Corporation BDN173CBA01 Datasheet & Stock
CTS CORP's adhesive peel and stick heat sinks provide a convenient and efficient solution for thermal management in a variety of electronic applications. These heat sinks feature a pre-applied adhesive, allowing for quick and easy installation without the need for additional adhesives or greases. The thermally optimized pin fin design ensures effective heat dissipation, while the excellent mechanical bond provides secure and reliable performance. Suitable for BGA, PGA, PLCC, and QFP packages, these heat sinks are ideal for applications where space is limited and assembly time is critical. The adhesive shear strength at 100°C is 36psi, ensuring robust performance under demanding conditions.
Frequently Asked Questions
Where can I buy CTS Corporation BDN173CBA01?
You can click on the BUY or RFQ button to purchase BDN173CBA01 from an authorized CTS Corporation distributor.
How do I troubleshoot issues or seek technical support for part BDN173CBA01?
You can download the BDN173CBA01 datasheet or visit the CTS Corporation website for support.
Who is the manufacturer of BDN173CBA01?
CTS Corporation