This high-quality card edge connector features a contact spacing of 0.156 inches (3.96 mm) and supports various mounting options including floating eyelets and threaded inserts. Designed for reliable electrical connections, it accepts P.C. board thickness of 0.062 inches (1.57 mm) and accommodates single or dual row configurations. Manufactured with UL 94V-0 thermoplastic polyester insulator and copper contacts with gold and tin plating, it offers current ratings of 3 Amperes, dielectric withstand of 1800 V AC, and operates from -65°C to +105°C. Suitable for industrial electronic assemblies requiring secure card-to-board connections and versatile mounting methods.
Insulator Material: Thermoplastic Polyester, UL 94V-0, Color: Green
Contact Material: Copper, Nickel, Tin Alloy CA-725
Contact Plating: Gold on Mating Area, Tin on Contact Tails, Nickel Underplate
Current Rating: 3 Amperes
Dielectric Withstanding Voltage: 1800 V AC rms at Sea Level
Insulation Resistance: 5000 Megohms Minimum
Operating Temperature: -65 to +105 Degrees C
Insertion Force: 16 oz (4.45 N) Max per contact pair
Withdrawal Force: 1 oz (0.28 N) Min per contact pair
Buy the EDAC 333 Series Card Edge Connector Part Number 333036524203
Purchase the Brand 333 Series card edge connector online today and benefit from high reliability in your electronic projects. Its 0.156-inch contact spacing ensures stable electrical connections, compatible with 0.062-inch thick P.C. boards. The connector features versatile mounting options, including floating eyelets and threaded inserts for secure attachment in industrial applications. Made from UL 94V-0 thermoplastic insulator and gold-plated copper contacts, it offers excellent conductance, dielectric strength, and temperature tolerance. Fit for single or dual row configurations, this connector guarantees durability and performance for demanding electronic systems.
Order your Brand 333 Series card edge connector today and enhance your electronic assemblies with dependable, versatile connections suitable for industrial environments.
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