This card edge connector features a 0.156-inch contact spacing (3.96 mm), with 86 contacts arranged in single or dual row configurations. Made from UL 94V-0 thermoplastic polyester insulator and copper, nickel, tin alloy contacts with gold and tin plating, it supports up to 3 amperes and withstands voltages of 1800 V AC rms between contacts. It accepts PCB thickness of 0.062 inches (1.57 mm), offers different mounting options including flush or offset lugs, and has high-profile insulator bodies measuring 0.600 inches (15.24 mm) for reliable connections in electronic assemblies.
Insulator Material: Thermoplastic Polyester, UL 94V-0
Contact Material: Copper, Nickel, Tin Alloy CA-725
Contact Plating: Gold on the Mating Area, Tin on the Contact Tails, Nickel Underplate
Current Rating: 3 Amperes Continuous
Contact Resistance: 10 Milliohms Maximum
Dielectric Withstanding Voltage: 1800 V AC rms between adjacent contacts
Insulation Resistance: 5000 Megohms Minimum
Operating Temperature: -65°C to +105°C
Contact Spacing: 0.156 inches (3.96 mm)
Total Contacts: 86 (single or dual row configurations)
P.C. Tail Size: 0.025 square inches (0.64 mm square)
Tail Length: 0.150 inches (3.81 mm)
Mounting Holes Diameter: 0.128 inches (3.25 mm)
Body Height: 0.600 inches (15.24 mm)
Buy the Buy Series Card Edge Connector Part Number 337086521802 Online
Enhance your electronic assemblies with our Series 337 Card Edge Connector, featuring 86 contacts spaced at 0.156 inches, UL rated thermoplastic insulator, and gold-plated contacts for superior connectivity. This versatile connector offers various mounting options including flush and offset lugs, supports PCB thickness of 0.062 inches, and is designed to withstand voltages up to 1800 V AC rms. Easy to install, reliable, and ideal for a wide range of applications, order now to ensure your projects perform with dependable quality.
Order your Series 337 Card Edge Connector today and enjoy high reliability, secure mounting options, and durable, gold-plated contacts for your electronic projects.
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