This professional card edge connector features a 0.156-inch (3.96 mm) contact spacing, supporting 60 contacts in single or dual-row configurations. Made from UL 94V-0 thermoplastic polyester, it includes copper, nickel, tin alloy contacts with gold plating on the mating area, ensuring reliable electrical performance with a maximum contact resistance of 10 milliohms. Capable of operating within -65°C to +105°C, it supports various mounting options including no lugs or threaded inserts, making it ideal for high-density electronic board connections and compact device assemblies.
Insulator Material: Thermoplastic Polyester, UL 94V-0
Contact Material: Copper, Nickel, Tin Alloy CA-725
Contact Plating: Gold on the Mating Area, Tin on the Contact Tails, Nickel Underplate
Current Rating: 3 Amperes Continuous
Contact Resistance: 10 Milliohms Maximum
Dielectric Withstanding Voltage: 1800 V AC rms at Sea Level Between Adjacent Contacts
Insulation Resistance: 5000 Megohms Minimum
Operating Temperature: -65 to +105 Degrees C
Insertion Force: 16 oz (4.45 N) Maximum per Contact Pair
Withdrawal Force: 1 oz (0.28 N) Minimum per Contact Pair
Contact Spacing: 0.156 inches (3.96 mm)
Contact Tail Size: 0.025 inches Square (0.64 mm Square)
Tail Length: 0.150 inches (3.81 mm)
Series: 387
Number of Contacts: 60
Mounting options include threaded inserts, no lugs, or offset guides
Buy the Eaton Series 387 Card Edge Connector: 60 Contacts
Purchase the Eaton Series 387 Card Edge Connector online now for dependable electronic connections with precise contact spacing and versatile mounting options. Designed for reliability and high-performance applications, this connector supports up to 60 contacts, featuring gold-plated contacts and a temperature range of -65°C to +105°C. Whether you need threaded inserts or no lugs, buy this durable connector online to enhance your electronic assembly projects with ease and confidence, ensuring optimal performance and quality.
Order your Eaton Series 387 Card Edge Connector today and enjoy reliable connectivity solutions for high-density electronic designs.
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