The Type 44 Non-Silicone Heat Sink Compound is a grease-like thermal interface material made from 100% synthetic base stocks blended with thermally conductive fine metal oxide powders. It is designed as a non-silicone alternative, offering exceptional heat transfer efficiency, high dielectric strength, and thermal stability. This compound adheres well to metal surfaces, maintaining its properties without melting, bleeding, or hardening over time. Suitable for use in applications where silicone-based heat sink compounds are typically employed, it ensures effective heat dissipation from electrical devices to cooling mediums. The compound has a dropping point of 260°C and operates effectively within a temperature range of -30°C to 200°C.
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You can download the 108126 datasheet or visit the GC ELECTRONICS website for support.
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