The low-solids, no-clean flux pen is designed for rework of both conventional and surface mount circuit board assemblies. With an extremely low solids content of 2.0% and an activator system that leaves virtually no residue after soldering, it ensures clean, reliable connections without interfering with electrical testing. The flux enhances soldering performance by reducing solder bridges during rework operations and maintains higher surface insulation resistance compared to typical water-soluble fluxes. It contains a corrosion inhibitor, preventing corrosion on bare copper surfaces even in humid environments. This flux pen allows controlled, mess-free application, making it ideal for hand-soldering, maintenance, and repair tasks. It is flammable but eliminates the need for cleaning and leaves non-corrosive, tack-free residues.