myMectronic
myMectronic

A Premier B2B Part Search

MOLEX / WALDOM 1725018002 zSFP+ Interconnect System

The MOLEX / WALDOM 172501-8002 is a high-performance zSFP+ interconnect system designed for module-to-board applications. This receptacle features a stacked ganged assembly with metal spring fingers, providing enhanced airflow and 320 circuits for efficient data transmission. Constructed with a high-performance alloy (HPA) and gold plating for superior conductivity and durability, it's ideal for demanding industrial environments requiring reliable and high-speed connectivity. The connector supports a maximum current of 0.5A and a voltage of 30V AC/DC, ensuring stable power delivery. Its robust design and compliance with industry standards make it a versatile choice for various applications.

Authorized Distributors
Source:Newark
Part No:172501-8002
Stock:199
Inv Date:06-17-2026
Price: Unit price: $166.72
Buy/RFQ:
Source:DigiKey
Part No:1725018002
Stock:0
Inv Date:06-17-2026
Price: Unit price: $174.06
Buy/RFQ:
Source:DigiKey
Part No:1725018002
Stock:199
Inv Date:06-17-2026
Price: Unit price: $125.63
Buy/RFQ:
Part No:172501-8002
Stock:0
Inv Date:06-18-2026
Price: Unit price: $146.04
Buy/RFQ:
Part No:172501-8002
Stock:0
Inv Date:06-17-2026
Price: Unit price: $173.89
Buy/RFQ:
Part No:172501-8002
Stock:199
Inv Date:06-17-2026
Price: Unit price: $155.77
Buy/RFQ:
Part No:172501-8002
Stock:199
Inv Date:06-17-2026
Price: Unit price: $155.77
Buy/RFQ:

MOLEX / WALDOM 1725018002 zSFP+ Interconnect System Specifications:

  • Part Number: 1725018002
  • Status: Active
  • Overview: zSFP+ Interconnect System
  • Description: zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-8, with Enhanced Airflow, 320 Circuits
  • Circuits (Loaded): 320
  • Color - Resin: Black
  • Durability (mating cycles max): N/A
  • Gender: Female
  • Lock to Mating Part: Yes
  • Material - Metal: High Performance Alloy (HPA)
  • Material - Plating Mating: Gold
  • Material - Plating Termination: Matte Tin
  • Material - Resin: High Performance Thermoplastic
  • Net Weight: 153.860/g
  • Number of Rows: 2
  • Orientation: Right Angle
  • PC Tail Length: 1.70mm
  • PCB Locator: Yes
  • PCB Retention: Yes
  • PCB Thickness - Recommended: 0.80mm
  • Packaging Type: Tray
  • Panel Mount: No
  • Pitch - Mating Interface: 0.80mm
  • Pitch - Termination Interface: 0.80mm
  • Plating min - Mating: 0.762µm
  • Plating min - Termination: 0.762µm
  • Polarized to Mating Part: Yes
  • Polarized to PCB: Yes
  • Ports: 16
  • Surface Mount Compatible (SMC): Yes
  • Temperature Range - Operating: -40° to +85°C
  • Termination Interface: Style: Through Hole
  • Current - Maximum per Contact: 0.5A
  • Shield Type: Shielded
  • Voltage - Maximum: 30V AC (RMS)/DC
  • Lead-freeProcess Capability: N/A
  • EU ELV: Not Relevant
  • EU RoHS: Compliant
  • China RoHS: Not Contained Per - D(2020)9139-DC (19 Jan 2021)
  • Halogen-Free Status: Not Low-Halogen

Buy the 172501-8002 MOLEX / WALDOM zSFP+ Interconnect System | myMectronic

Purchase the MOLEX / WALDOM 172501-8002 zSFP+ Interconnect System securely and reliably with our online platform.

Buy Now

Frequently Asked Questions

Where can I buy MOLEX / WALDOM 1725018002?

You can click on the BUY or RFQ button to purchase 1725018002 from an authorized MOLEX / WALDOM distributor.

How do I troubleshoot issues or seek technical support for part 1725018002?

You can download the 1725018002 datasheet or visit the MOLEX / WALDOM website for support.

Who is the manufacturer of 1725018002?

MOLEX / WALDOM

MOLEX / WALDOM Part List

Browse and search other MOLEX / WALDOM parts, locate datasheets and stock

Sponsored by