MOLEX / WALDOM 1725018002 zSFP+ Interconnect System The MOLEX / WALDOM 172501-8002 is a high-performance zSFP+ interconnect system designed for module-to-board applications. This receptacle features a stacked ganged assembly with metal spring fingers, providing enhanced airflow and 320 circuits for efficient data transmission. Constructed with a high-performance alloy (HPA) and gold plating for superior conductivity and durability, it's ideal for demanding industrial environments requiring reliable and high-speed connectivity. The connector supports a maximum current of 0.5A and a voltage of 30V AC/DC, ensuring stable power delivery. Its robust design and compliance with industry standards make it a versatile choice for various applications.
Source Part No Stock Inv Date Qty/Price USD Buy/RFQ Authorized Distributors Newark 172501-8002 199 06-17-2026 Unit price: $166.72 BUYDigiKey 1725018002 0 06-17-2026 Unit price: $174.06 BUYDigiKey 1725018002 199 06-17-2026 Unit price: $125.63 BUYMouser Electronics 172501-8002 0 06-18-2026 Unit price: $146.04 BUYRS Americas, Inc 172501-8002 0 06-17-2026 Unit price: $173.89 BUYMaster Electronics 172501-8002 199 06-17-2026 Unit price: $155.77 BUYOnlinecomponents.com 172501-8002 199 06-17-2026 Unit price: $155.77 BUY
Authorized Distributors
Part No: 172501-8002
Stock: 199
Inv Date: 06-17-2026
Price: Unit price: $166.72
Part No: 1725018002
Stock: 0
Inv Date: 06-17-2026
Price: Unit price: $174.06
Part No: 1725018002
Stock: 199
Inv Date: 06-17-2026
Price: Unit price: $125.63
Part No: 172501-8002
Stock: 0
Inv Date: 06-18-2026
Price: Unit price: $146.04
Part No: 172501-8002
Stock: 0
Inv Date: 06-17-2026
Price: Unit price: $173.89
Part No: 172501-8002
Stock: 199
Inv Date: 06-17-2026
Price: Unit price: $155.77
Part No: 172501-8002
Stock: 199
Inv Date: 06-17-2026
Price: Unit price: $155.77
MOLEX / WALDOM 1725018002 zSFP+ Interconnect System Specifications: Part Number: 1725018002 Status: Active Overview: zSFP+ Interconnect System Description: zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-8, with Enhanced Airflow, 320 Circuits Circuits (Loaded): 320 Color - Resin: Black Durability (mating cycles max): N/A Gender: Female Lock to Mating Part: Yes Material - Metal: High Performance Alloy (HPA) Material - Plating Mating: Gold Material - Plating Termination: Matte Tin Material - Resin: High Performance Thermoplastic Net Weight: 153.860/g Number of Rows: 2 Orientation: Right Angle PC Tail Length: 1.70mm PCB Locator: Yes PCB Retention: Yes PCB Thickness - Recommended: 0.80mm Packaging Type: Tray Panel Mount: No Pitch - Mating Interface: 0.80mm Pitch - Termination Interface: 0.80mm Plating min - Mating: 0.762µm Plating min - Termination: 0.762µm Polarized to Mating Part: Yes Polarized to PCB: Yes Ports: 16 Surface Mount Compatible (SMC): Yes Temperature Range - Operating: -40° to +85°C Termination Interface: Style: Through Hole Current - Maximum per Contact: 0.5A Shield Type: Shielded Voltage - Maximum: 30V AC (RMS)/DC Lead-freeProcess Capability: N/A EU ELV: Not Relevant EU RoHS: Compliant China RoHS: Not Contained Per - D(2020)9139-DC (19 Jan 2021) Halogen-Free Status: Not Low-Halogen Buy the 172501-8002 MOLEX / WALDOM zSFP+ Interconnect System | myMectronic Purchase the MOLEX / WALDOM 172501-8002 zSFP+ Interconnect System securely and reliably with our online platform.
Buy Now Frequently Asked Questions Where can I buy MOLEX / WALDOM 1725018002? You can click on the BUY or RFQ button to purchase 1725018002 from an authorized MOLEX / WALDOM distributor.
How do I troubleshoot issues or seek technical support for part 1725018002? You can download the 1725018002 datasheet or visit the MOLEX / WALDOM website for support.
Who is the manufacturer of 1725018002? MOLEX / WALDOM
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