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MOLEX / WALDOM 532531470 Micro-Latch Wire-to-Board Header
The MOLEX / WALDOM 53253-1470 Micro-Latch™ wire-to-board header provides a robust and reliable connection solution for various electronic applications. Its 2.00mm pitch and vertical orientation make it ideal for space-constrained designs. The header features a square pin configuration and a three-sided shroud to ensure secure mating and prevent accidental disconnections. Constructed with brass and tin plating for durability and corrosion resistance, this header is suitable for applications in consumer electronics, industrial equipment, and automotive systems. It is designed to mate with 51065 Crimp Housing and 50212 Crimp Terminal.
MOLEX / WALDOM 532531470 Micro-Latch Wire-to-Board Header Specifications:
- Circuits (Loaded): 14
- Circuits (maximum): 14
- Durability (mating cycles max): 30
- Material - Metal: Brass
- Material - Plating Mating: Tin (1.016µm min)
- Material - Plating Termination: Tin (1.016µm min)
- Material - Resin: Nylon
- Orientation: Vertical
- PCB Tail Length: 3.50mm
- PCB Thickness - Recommended: 1.60mm
- Pitch - Mating Interface: 2.00mm
- Polarized to Mating Part: Yes
- Temperature Range - Operating: -40°C to +105°C
- Termination Interface: Style: Through Hole
- Current - Maximum per Contact: 2.0A
- Voltage - Maximum: 125V
- RoHS Compliant: Compliant
- REACH SVHC: Not Contained
- Halogen-Free Status: Not Low-Halogen
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Frequently Asked Questions
Where can I buy MOLEX / WALDOM 532531470?
You can click on the BUY or RFQ button to purchase 532531470 from an authorized MOLEX / WALDOM distributor.
How do I troubleshoot issues or seek technical support for part 532531470?
You can download the 532531470 datasheet or visit the MOLEX / WALDOM website for support.
Who is the manufacturer of 532531470?
MOLEX / WALDOM