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MOLEX / WALDOM 554500869 Wire-to-Board Header
The MOLEX / WALDOM 55450-0869 is a miniature wire-to-board header designed for reliable connections in space-constrained applications. This header utilizes a 1.25mm pitch and features 8 circuits arranged in a single, vertical row. Constructed with brass and tin plating for enhanced conductivity and durability, it is suitable for applications requiring robust and secure wire-to-board connections. Its surface mount design simplifies integration into PCB assemblies, and its RoHS compliance ensures environmental responsibility. Mates with 54596 IDT Receptacle Housing.
MOLEX / WALDOM 554500869 Wire-to-Board Header Specifications:
- Pitch - Mating Interface: 1.25mm
- Circuits (maximum): 8
- Material - Resin: High Temperature Thermoplastic
- Durability (mating cycles max): 30
- Mating Material - Plating: Tin
- Termination Material - Resin: High Temperature Thermoplastic
- Current - Maximum per Contact: 1.5A
- Voltage - Maximum: 100V
- Material - Metal: Brass
- Plating min - Mating: 1.016µm
- Plating min - Termination: 1.016µm
- Mated Height: 8.40mm
- Temperature Range - Operating: -40°C to +105°C
- Net Weight: 376.900/mg
- Number of Rows: 1
- Orientation: Vertical
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Frequently Asked Questions
Where can I buy MOLEX / WALDOM 554500869?
You can click on the BUY or RFQ button to purchase 554500869 from an authorized MOLEX / WALDOM distributor.
How do I troubleshoot issues or seek technical support for part 554500869?
You can download the 554500869 datasheet or visit the MOLEX / WALDOM website for support.
Who is the manufacturer of 554500869?
MOLEX / WALDOM