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MOLEX / WALDOM 554540570 Wire-to-Board Header
The MOLEX / WALDOM 55454-0570 is a wire-to-board header within the 55454 series, designed for compact and reliable connections in various electronic applications. This header features a 1.25mm pitch and a right-angle orientation, making it suitable for space-constrained designs. It is part of the Mini Mi II™ system and offers 5 circuits for versatile connectivity. The header is RoHS compliant and features a durable construction with a tin plating finish, ensuring long-term performance and reliability in demanding environments.
MOLEX / WALDOM 554540570 Wire-to-Board Header Specifications:
- Pitch - Mating Interface: 1.25mm
- Circuits (maximum): 5
- Material - Plating: Tin
- Material - Plating Termination: Tin
- Current - Maximum per Contact: 1.5A
- Voltage - Maximum: 100V
- PCB Tail Length: 3.00mm
- Number of Rows: 1
- Durability (mating cycles max): 30
- Net Weight: 315.900/mg
- Temperature Range - Operating: -40°C to +105°C
- Termination Interface: Style: Through Hole
- Breakaway Circuits (Loaded): No
- Guide to Mating Part: No
- Keying to Mating Part: No
- Lock to Mating Part: Yes
- PCB Retention: Yes
- PCB Thickness - Recommended: 1.60mm
- Stackable: No
- Polarized to Mating Part: Yes
- Shrouded: Fully
- Surface Mount Compatible (SMC): No
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Frequently Asked Questions
Where can I buy MOLEX / WALDOM 554540570?
You can click on the BUY or RFQ button to purchase 554540570 from an authorized MOLEX / WALDOM distributor.
How do I troubleshoot issues or seek technical support for part 554540570?
You can download the 554540570 datasheet or visit the MOLEX / WALDOM website for support.
Who is the manufacturer of 554540570?
MOLEX / WALDOM