The MOLEX / WALDOM 55917-2010 MicroClasp Wire-to-Board Header is a robust and reliable connector solution for wire-to-board applications. Designed with a 2.00mm pitch and a dual-row, vertical layout, this header accommodates 20 circuits and incorporates a PCB locator for accurate placement. Constructed with a polyester resin and tin plating for both mating and termination interfaces, it offers excellent signal integrity and durability. The header is rated for a maximum current of 3.0A and a maximum voltage of 250V, making it suitable for a wide range of industrial and commercial applications. It is RoHS compliant and features a lock to mating part for secure connections.