The MOLEX / WALDOM 55932-0210 MicroClasp Wire-to-Board Header is a robust and reliable solution for connecting wires to printed circuit boards. Designed with a 2.00mm pitch and a vertical orientation, this header provides a secure and space-efficient connection. It incorporates a PCB locator to simplify alignment and ensure accurate placement during assembly. The header is constructed with durable materials, including a polyester resin and tin plating for both mating and termination interfaces. It is ideal for a wide range of applications requiring a compact and dependable wire-to-board connection, such as consumer electronics, industrial automation, and automotive systems. Its RoHS compliance and operating temperature range make it suitable for diverse environments.