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MOLEX / WALDOM 559320930 MicroClasp Wire-to-Board Header
The MOLEX / WALDOM 55932-0930 is a MicroClasp™ Wire-to-Board Header designed for robust wire-to-board connections. This header offers a 2.00mm pitch, a vertical orientation, and is configured with 9 circuits. It incorporates features like PCB retention and a fully shrouded design for enhanced protection. The header is constructed with a polyester resin and tin plating for both mating and termination interfaces, ensuring reliable electrical contact and durability in various industrial applications. It is RoHS compliant and suitable for a wide range of electronic devices and systems.
MOLEX / WALDOM 559320930 MicroClasp Wire-to-Board Header Specifications:
- pitch_mating_interface: 2.00mm
- circuits_loaded: 9
- circuits_maximum: 9
- orientation: Vertical
- pcb_tail_length: 3.20mm
- pcb_retention: Yes
- pcb_thickness_recommended: 1.60mm
- material_plating_mating: Tin
- material_plating_termination: Tin
- material_resin: Polyester
- durability_mating_cycles_max: 30
- current_maximum_per_contact: 3.0A
- voltage_maximum: 250V
- temperature_range_operating: -25°C to +85°C
- termination_interface_style: Through Hole
- number_of_rows: 1
- color_resin: Natural
- breakaway: No
- guide_to_mating_part: None
- lock_to_mating_part: Yes
- shrouded: Fully
- surface_mount_compatible: No
- net_weight: 886.600/mg
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Frequently Asked Questions
Where can I buy MOLEX / WALDOM 559320930?
You can click on the BUY or RFQ button to purchase 559320930 from an authorized MOLEX / WALDOM distributor.
How do I troubleshoot issues or seek technical support for part 559320930?
You can download the 559320930 datasheet or visit the MOLEX / WALDOM website for support.
Who is the manufacturer of 559320930?
MOLEX / WALDOM