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MOLEX / WALDOM 559350530 MicroClasp Wire-to-Board Header
The MOLEX / WALDOM 55935-0530 MicroClasp wire-to-board header is a compact and reliable solution for connecting wires to printed circuit boards. With a 2.00mm pitch and a right-angle orientation, this header provides a secure and space-saving connection. It is designed for applications requiring a robust and durable wire-to-board interface, commonly found in consumer electronics, industrial equipment, and automotive systems. The header's RoHS compliance and halogen-free status align with environmental regulations and industry standards.
MOLEX / WALDOM 559350530 MicroClasp Wire-to-Board Header Specifications:
- pitch_mating_interface: 2.00mm
- circuits_loaded: 5
- circuits_maximum: 5
- orientation: Right Angle
- pcb_tail_length: 3.20mm
- pcb_thickness_recommended: 1.60mm
- termination_interface_style: Through Hole
- material_plating_mating: Tin
- material_plating_termination: Tin
- material_resin: Polyester
- durability_mating_cycles_max: 30
- current_maximum_per_contact: 3.0A
- voltage_maximum: 250V
- temperature_range_operating: -25°C to +85°C
- number_of_rows: 1
- shrouded: Fully Stackable
- surface_mount_compatible: No
- pcb_locator: No
- pcb_retention: Yes
- keying_to_mating_part: None
- lock_to_mating_part: Yes
- net_weight: 604.600/mg
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Frequently Asked Questions
Where can I buy MOLEX / WALDOM 559350530?
You can click on the BUY or RFQ button to purchase 559350530 from an authorized MOLEX / WALDOM distributor.
How do I troubleshoot issues or seek technical support for part 559350530?
You can download the 559350530 datasheet or visit the MOLEX / WALDOM website for support.
Who is the manufacturer of 559350530?
MOLEX / WALDOM