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MOLEX / WALDOM 559350630 MicroClasp Wire-to-Board Header
The MOLEX / WALDOM 55935-0630 MicroClasp wire-to-board header is a compact and reliable solution for connecting wires to printed circuit boards. With a 2.00mm pitch and right-angle orientation, this header is ideal for applications where space is limited. It is designed for secure connections and offers excellent durability with a 30 mating cycle rating. The header's polyester resin construction and tin plating provide long-lasting performance in industrial and consumer electronics applications.
MOLEX / WALDOM 559350630 MicroClasp Wire-to-Board Header Specifications:
- Pitch - Mating Interface: 2.00mm
- Circuits (Loaded): 6
- Circuits (maximum): 6
- Material - Plating Mating: Tin
- Material - Plating Termination: Tin
- Material - Resin: Polyester
- Orientation: Right Angle
- PC Tail Length: 3.20mm
- PCB Thickness - Recommended: 1.60mm
- Current - Maximum per Contact: 3.0A
- Voltage - Maximum: 250V
- Durability (mating cycles max): 30
- First Mate / Last Break: No
- Glow-Wire Compliant: No
- Number of Rows: 1
- Temperature Range - Operating: -25°C to +85°C
- Termination Interface: Style: Through Hole
- Color - Resin: Natural
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Frequently Asked Questions
Where can I buy MOLEX / WALDOM 559350630?
You can click on the BUY or RFQ button to purchase 559350630 from an authorized MOLEX / WALDOM distributor.
How do I troubleshoot issues or seek technical support for part 559350630?
You can download the 559350630 datasheet or visit the MOLEX / WALDOM website for support.
Who is the manufacturer of 559350630?
MOLEX / WALDOM