The MOLEX / WALDOM 55935-1230 MicroClasp Wire-to-Board Header is a compact and reliable solution for connecting wires to printed circuit boards. With a 2.00mm pitch and a right-angle orientation, this header is ideal for applications where space is limited. It supports 12 circuits and is designed for durability, offering up to 30 mating cycles. The header's polyester resin construction and tin plating provide excellent electrical conductivity and corrosion resistance, making it suitable for a wide range of industrial and consumer electronics applications. It is RoHS compliant and features a lock to mating part for secure connections.