The MOLEX / WALDOM 76066-5001 is a high-performance SFP+ and SFP interconnect solution specifically engineered for module-to-board applications. This connector boasts 160 circuits and utilizes a female gender design, ensuring a secure and reliable connection. The integrated EMI metal gasket provides excellent shielding against electromagnetic interference, crucial for maintaining signal integrity in demanding environments. Constructed with a high-performance alloy (HPA) for the metal components and a high-temperature thermoplastic resin, this connector offers durability and reliability. Its tin-plated termination and gold-plated mating interface ensure excellent solderability and low contact resistance. The 76066-5001 is suitable for a wide range of industrial applications requiring high-speed data transmission and robust connectivity.