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MOLEX / WALDOM 879141246 Dual Row Header Single Wafer

The MOLEX / WALDOM 87914-1246 is a dual row header connector designed for vertical board mounting applications. Constructed with LCP (Lens, Crystal Polymer) and copper alloy, it offers excellent durability and electrical performance. Available with various plating options, including gold flash and tin, it caters to diverse needs. The connector's design facilitates secure and reliable connections in electronic assemblies, commonly used in industrial equipment, consumer electronics, and automotive applications. Its compact size and robust construction make it suitable for space-constrained environments while ensuring long-term reliability.

Authorized Distributors
Source:Newark
Part No:87914-1246
Stock:21895
Inv Date:06-16-2026
Price: Unit price: $0.854
Buy/RFQ:
Part No:87914-1246
Stock:2406
Inv Date:06-17-2026
Price: Unit price: $1.28
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Part No:87914-1246
Stock:0
Inv Date:06-17-2026
Price: Unit price: $0.67
Buy/RFQ:
Part No:87914-1246
Stock:21895
Inv Date:06-17-2026
Price: Unit price: $0.6834
Buy/RFQ:
Part No:87914-1246
Stock:21895
Inv Date:06-17-2026
Price: Unit price: $0.6834
Buy/RFQ:

MOLEX / WALDOM 879141246 Dual Row Header Single Wafer Specifications:

  • Material: HSG: LCP, GLASS-FILLED, UL94V-0, COLOR: BLACK PIN: 0.64MM SQ PIN, COPPER ALLOY
  • Plating Type: - 0.0254 µm GOLD FLASH OVER 1.25 µm MIN. NICKEL OVERALL - 0.025 µm MIN. GOLD PLATE ON CONTACT AND 1.88 µm MIN. TIN ON SOLDERTAIL OVER 1.25 µm MIN. NICKEL OVERALL - 0.25 µm MIN. GOLD PLATE ON CONTACT AND 1.88 µm MIN. TIN ON SOLDERTAIL OVER 1.25 µm MIN. NICKEL OVERALL - 0.38 µm MIN. GOLD PLATE ON CONTACT AND 1.88 µm MIN. TIN ON SOLDERTAIL OVER 1.25 µm MIN. NICKEL OVERALL - 0.75 µm MIN. GOLD PLATE ON CONTACT AND 1.88 µm MIN. TIN ON SOLDERTAIL OVER 1.25 µm MIN. NICKEL OVERALL - 2.50 µm MIN. TIN IN SELECTED AREA OVER 1.25 m MIN. NICKEL OVERALL - 0.38 µm MIN. GOLD PLATE ON CONTACT AND 2.50 µm MIN. TIN ON SOLDERTAIL OVER 1.25 µm MIN. NICKEL OVERALL - 0.38 µm MIN. GOLD PLATE ON CONTACT AND 0.05 µm MIN. GOLD FLASH ON SOLDERTAIL OVER 1.25 µm MIN. NICKEL OVERALL - 0.05 - 0.25 µm MIN. GOLD FLASH OVER 1.25 µm MIN. NICKEL OVERALL
  • Pin Pushout Force: 1KG MIN IN EITHER DIRECTION
  • Recommended PCB Thickness: 1.60MM
  • Product Specification: PS-87920-019
  • Wafer Flatness: 0.003mm/mm C
  • Stackability: Not Stackable
  • Cap Placement: Central of part as possible with the top surface flat

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Frequently Asked Questions

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You can click on the BUY or RFQ button to purchase 879141246 from an authorized MOLEX / WALDOM distributor.

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You can download the 879141246 datasheet or visit the MOLEX / WALDOM website for support.

Who is the manufacturer of 879141246?

MOLEX / WALDOM

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