MOLEX / WALDOM 901430034 C-Grid III Modular Crimp Housing
The MOLEX / WALDOM 90143-0034 C-Grid III Modular Crimp Housing is a versatile component for signal transmission in wire-to-board applications. This housing accommodates 34 circuits and utilizes a 2.54mm pitch for precise alignment and secure connections. Manufactured from durable black PPO resin, it offers excellent insulation and mechanical strength. The housing is designed to mate with C-Grid III headers and crimp terminals, providing a complete connection system. Its stackable design allows for increased density in compact applications. It is RoHS compliant and suitable for operating temperatures ranging from -55°C to +105°C, making it ideal for a wide range of industrial and commercial environments.