The MC33266 is a vertical-mounting extruded heat sink designed for a single TO-218/TO-220 package. It features high power dissipation capabilities, a notched base for improved thermal contact, solderable mounting pins, pre-drilled mounting holes for easy installation, and a black anodized finish for durability and corrosion resistance. Ideal for managing heat in power electronics and thermal management solutions, it offers choice of thermal resistance, with options of 3.9°C/W, 3.6°C/W, or 3.1°C/W depending on the model. Compact and durable, it ensures efficient heat transfer and reliable operation.
Order the multicomp MC33266 extruded heatsink online today for reliable thermal management of your electronic devices. Featuring a high power dissipation capability of 3.6°C/W, it is designed for easy installation with solderable pins and pre-drilled holes. The notched base improves thermal contact, while the black anodize finish provides durability and corrosion resistance. Ideal for use in power electronics, HVAC, and other high-performance applications, this heatsink offers superior heat transfer, ensuring your components operate reliably and efficiently. Purchase now for fast delivery and expert support.
You can click on the BUY or RFQ button to purchase MC33266 from an authorized MULTICOMP PRO distributor.
You can download the MC33266 datasheet or visit the MULTICOMP PRO website for support.
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