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MULTICOMP PRO MC33274 High Power Dissipation Heatsink
The MC33274 is a compact, high-power dissipation heat sink measuring 50 x 35 x 25.6mm. It features a vertical mounting design with solderable fixing pins, allowing for easy installation through mounting holes. The heat sink is suitable for use with a single TO-218, TO-220, or TO-247 package device, utilizing a clip for secure attachment.
MULTICOMP PRO MC33274 High Power Dissipation Heatsink Specifications:
- Thermal Resistance: 7.2°C/W
- Dimensions: Height 38mm, Width 25.6mm, Length not specified
- Material: Extruded aluminum
- Mounting: Solderable PCB pins or mounting hole
- Compatible Packages: TO-218, TO-220, TO-247
- Design: Vertical mounting heatsink
- Application: High power dissipation for electronic components
Buy the Multicomp Series Heatsink: High Power Dissipation MC33274
Order the Multicomp MC33274 heatsink online today for efficient cooling of high-power electronic components. Featuring a compact design, vertical mounting with solderable pins, and compatibility with TO-218, TO-220, and TO-247 packages, this heatsink ensures reliable thermal management. Its low thermal resistance of 7.2°C/W enhances heat dissipation, preventing overheating. The easy-to-install clip or screw mounting allows quick assembly, ideal for demanding applications requiring high power dissipation and space-saving thermal solutions.
Buy Multicomp MC33274 now and experience unmatched reliability and high thermal performance for your electronic cooling needs.
Frequently Asked Questions
Where can I buy MULTICOMP PRO MC33274?
You can click on the BUY or RFQ button to purchase MC33274 from an authorized MULTICOMP PRO distributor.
How do I troubleshoot issues or seek technical support for part MC33274?
You can download the MC33274 datasheet or visit the MULTICOMP PRO website for support.
Who is the manufacturer of MC33274?
MULTICOMP PRO