The MC33275 is a compact high-power dissipation extruded heatsink measuring 50 mm in height, 35 mm in width, and 25.6 mm in length. Designed for vertical mounting with solderable fixing pins, it offers efficient thermal management for high-power electronic components. Compatible with TO-220, TO-218, and TO-247 packages, this heatsink provides options with or without mounting holes and different thermal resistance values of 5.9°C/W for optimal heat dissipation. Ideal for industrial and power electronics applications requiring reliable heat sinking solutions.
Discover the high-quality Multicomp Series aluminum heatsink MC33275 designed for efficient thermal management in power electronics. With dimensions of 50 mm x 35 mm x 25.6 mm and a thermal resistance of 5.9°C/W, it provides optimal heat dissipation for TO-220, TO-18, and TO-247 packages. Featuring solderable pins and mounting options with or without holes, this heatsink is ideal for industrial, power supply, and amplifier applications. Buy online today for quick delivery and dependable cooling performance.
You can click on the BUY or RFQ button to purchase MC33275 from an authorized MULTICOMP PRO distributor.
You can download the MC33275 datasheet or visit the MULTICOMP PRO website for support.
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