The MC33290 from Multicomp is an extruded heatsink designed for TO-220 package devices. It features a compact, black anodized finish with solderable fixing pins, vertical mounting capability, and pre-drilled mounting holes. With a height of 50mm and a width of 34.53mm, it offers a thermal resistance of 8.8°C/W, suitable for industrial applications. Multicomp products are highly rated, with a customer rating of 4.6 out of 5 stars, and a 12-month limited warranty is provided.
Order the Multicomp MC33290 heatsink online today to ensure optimal heat dissipation for your TO-220 package devices. Its black anodized finish, solderable fixing pins, and pre-drilled mounting holes simplify installation. With a thermal resistance of 8.8°C/W, it provides efficient cooling critical for electronic components in industrial environments. Designed for vertical mounting, this extruded heatsink offers durability, high performance, and versatile application options. Purchase online now for fast delivery and improve your thermal management system reliably.
You can click on the BUY or RFQ button to purchase MC33290 from an authorized MULTICOMP-PRO distributor.
You can download the MC33290 datasheet or visit the MULTICOMP-PRO website for support.
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