MULTICOMP-PRO MPGCS020NS20020 Thermal Interface Pad

This high-performance non-silicone thermal interface pad provides excellent thermal conductivity of 2W/mK, good electrical insulation, and long-term stability. Suitable for electronic devices requiring reliable heat dissipation, it features good compressibility and a single-sided 3M-467 adhesive for easy application. Available in various thicknesses from 0.5mm to 3mm, this light grey pad ensures effective heat transfer while maintaining electrical insulation, supporting temperatures from -40°C up to +150°C. Ideal for use in electronic assembly and thermal management systems.

View MPGCS020NS20020Datasheet [pdf]

Buy the Multicomp Series Thermal Interface Pad: MPGCS-020NS-200-0.5

Discover the high-performance thermal interface pad designed for efficient heat transfer and electrical insulation. With 2W/mK thermal conductivity, it features excellent compressibility and stability, suitable for electronic assemblies operating from -40°C to +150°C. Available in various thicknesses, the pad has a light grey color and a single-sided 3M-467 adhesive for easy application. Its flame rating of V-0 UL94 ensures safety and reliability. Perfect for professional electronic cooling and thermal management systems that demand durability and precise heat conduction.

Order your Multicomp Series MPGCS-020NS-200-0.5 thermal interface pad today and ensure reliable heat dissipation for your electronic projects with high-quality performance.