High-performance thermal management solution with ultra soft, compressible thermal pads for electronic components. Featuring 2.2 W/mK thermal conductivity, these pads are suitable for ICs, CPUs, motherboards, power supplies, and LED applications. Available in various thicknesses from 0.5mm to 2mm, they offer excellent insulation, easy assembly with non-sticky surfaces on one side, and RoHS compliance. Designed for optimal heat dissipation, they perform reliably across a temperature range of -40°C to +180°C, ensuring efficient cooling in high-power electronic devices.
Discover the high-quality Multicomp Series Ultra Soft Thermal Pads, designed to provide efficient heat dissipation for electronic components. With a thermal conductivity of 2.2 W/mK, these pads are available in various thicknesses from 0.5mm to 2mm, offering excellent compressibility, insulation, and easy application thanks to a non-sticky surface on one side. Suitable for ICs, motherboards, power supplies, and LED applications, they operate reliably across a temperature range of -40°C to +180°C, ensuring optimal device performance.
You can click on the BUY or RFQ button to purchase MPTGA220015015 from an authorized MULTICOMP-PRO distributor.
You can download the MPTGA220015015 datasheet or visit the MULTICOMP-PRO website for support.
MULTICOMP-PRO