The Ultra Soft Thermal Pad from multicomp pro provides high thermal conductivity of 6.2 W/mK, making it ideal for high-power electronic applications. This blue-colored thermal pad offers excellent conformability, natural tack, and features flame rating V-0 UL94, dielectric breakdown voltage of 6 kV/mm, and a density of 3.1 g/cm³. Its flexible thickness ranges from 0.5 mm to 8 mm, suitable for ICs, CPUs, motherboards, power supplies, LED modules, telecom devices, and more. Operating within -50°C to +150°C, it efficiently manages heat and minimizes thermal resistance across contact surfaces.
Purchase the high-performance multicomp pro Ultra Soft Thermal Pad MPTGA620015015 online today. Designed for effective heat dissipation in high-power electronic components, this blue thermal pad offers excellent conformability, a wide range of thickness options from 0.5 mm to 8 mm, and a high thermal conductivity of 6.2 W/mK. It complies with RoHS standards, features a V-0 flame rating, and operates efficiently across temperatures from -50°C to +150°C. Ideal for CPUs, GPUs, motherboards, LED modules, and telecom devices, this product ensures optimal thermal performance and durability in demanding environments.
You can click on the BUY or RFQ button to purchase MPTGA620015015 from an authorized MULTICOMP-PRO distributor.
You can download the MPTGA620015015 datasheet or visit the MULTICOMP-PRO website for support.
MULTICOMP-PRO