Ohmite's C Series heatsinks are designed for high-performance, low-cost cooling solutions for TO-126, TO-220, TO-247, and TO-264 devices. Featuring an integrated camming clip system, these heatsinks enable tool-free assembly, reducing costs and improving efficiency. The large surface area and consistent mounting force ensure maximum thermal transfer, making them suitable for high-power density and small-size electronic packaging with forced convection cooling. The resilient spring action locks components securely, preventing short circuits and offering design flexibility for dynamic device locations and power upgrades.