Ohmite's B60/C60 series heat sink system provides a robust and efficient solution for managing heat dissipation in electronic packaging. Designed with a flexible, high-performance, and compact footprint, this heat sink utilizes an exchangeable cam clip system for compatibility with TO-247 and TO-264 devices. The integrated lip simplifies mounting, while the optional B series allows for tapping to accommodate Ohmite resistors or other components. Suitable for thru-hole soldering as a single or dual unit, it can be paired with a 60mm fan for enhanced thermal performance, making it an ideal choice for high-power density and small-size electronic applications.