Ohmite's D Series heatsinks offer a superior thermal performance solution for TO-252, TO-263, and TO-268 packages. The unique design, featuring tin-plated, solderable rods mechanically forged to an aluminum extruded body, reduces thermal resistance and eliminates air gaps. This innovative approach maximizes surface area for cooling, resulting in improved heat dissipation compared to traditional stamped aluminum heatsinks. The D Series is RoHS compliant and available in bulk or tape & reel packaging, making it suitable for both manual and automated assembly processes. Ideal for applications requiring efficient thermal management of semiconductors and resistors.