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Ohmite MV30127E Heat Sink with Clips
Ohmite's M series heat sinks offer a unique solution for thermal management in electronic packaging. The patented matrix clip system eliminates the need for fasteners, reducing assembly costs and labor. The heat sink's design maximizes surface area and provides consistent mounting force, resulting in efficient cooling and reliable performance. Its configurable and scalable nature allows designers to tailor the heat sink to specific packaging and power dissipation requirements, making it suitable for a wide range of applications including 1U or 2U electronic packaging with forced convection cooling.
Ohmite MV30127E Heat Sink with Clips Specifications:
- Surface Area: 37.3 / 24,161 (in2/mm2)
- Weight: 2.3 / 66 (oz./g)
- Thermal Resistance: 5.5 (°c/w)
- Material: Aluminum Alloy 6063-T5 or Equivalent
- Finish: degreased or black anodized
- Spring Clip Material: Music Wire, Per ASTM A228 with bright nickelplating
- Solder Foot Material: Cold-rolled Steel, Per ASTM A-366 with pure tin over copper strike
- Interface thermal resistance: Thermaljoint compound or 0.005 Grafoil
- Interface electrical isolation: Sil-Pad 900S
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Frequently Asked Questions
Where can I buy Ohmite MV30127E?
You can click on the BUY or RFQ button to purchase MV30127E from an authorized Ohmite distributor.
How do I troubleshoot issues or seek technical support for part MV30127E?
You can download the MV30127E datasheet or visit the Ohmite website for support.
Who is the manufacturer of MV30127E?
Ohmite