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STMICROELECTRONICS BALCC2501D3 Balun Matching Network
STMicroelectronics' BAL-CC25-01D3 is an ultra-miniature balun that integrates a matching network within a monolithic glass substrate. This component is specifically designed for use with CC25xx and CC85xx RF transceivers, leveraging STMicroelectronics' IPD (integrated passive device) technology to optimize RF performance. It offers a compact design, low insertion loss, and contributes to BOM count reduction, making it suitable for space-constrained applications requiring high RF performance.
STMICROELECTRONICS BALCC2501D3 Balun Matching Network Specifications:
- Absolute Maximum Ratings - Input Power: 20 dBm
- ESD Ratings (HBM): 2000 V
- ESD Ratings (MM): 500 V
- ESD Ratings (CDM): 500 V
- Operating Temperature: -40 to +125 °C
- Nominal Differential Output Impedance: Conjugate match to CC25xx, CC85xx
- Frequency Range: 2379 - 2507 GHz
- Insertion Loss: 0.66 dB
- Single Ended Return Loss: 19 dB
- Differential Ended Return Loss: 19 dB
- Phase Imbalance: 14 °
- Amplitude Imbalance: 0.3 dB
- Bump Height: 0.155 - 0.255 mm
- Substrate Thickness: 0.400 mm
- Bump Diameter: 0.215 - 0.295 mm
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Frequently Asked Questions
Where can I buy STMICROELECTRONICS BALCC2501D3?
You can click on the BUY or RFQ button to purchase BALCC2501D3 from an authorized STMICROELECTRONICS distributor.
How do I troubleshoot issues or seek technical support for part BALCC2501D3?
You can download the BALCC2501D3 datasheet or visit the STMICROELECTRONICS website for support.
Who is the manufacturer of BALCC2501D3?
STMICROELECTRONICS