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SAMTEC CLP10302FDBE Low Profile Dual Wipe Socket
The SAMTEC CLP series is a low-profile dual wipe socket designed for applications requiring high mating cycles and reliable connections. Constructed with phosphor bronze contacts and available with gold or tin plating over a nickel underplate, these sockets offer excellent conductivity and durability. They are RoHS compliant and operate effectively within a temperature range of -55°C to +125°C. The CLP series is ideal for surface mount applications and is compatible with Tiger Claw connectors, making them suitable for a wide range of electronic devices and systems. Custom options like single row configurations and alternative platings are available upon request.
SAMTEC CLP10302FDBE Low Profile Dual Wipe Socket Specifications:
- Insulator Material: Black Liquid Crystal Polymer
- Contact Material: Phosphor Bronze
- Plating: Sn or Au over 50 µ" (1.27 µm) Ni
- Current Rating: 3.4 A per pin (2 pins powered)
- Voltage Rating: 280 VAC/395 VDC
- Operating Temp Range: -55 °C to +125 °C
- Insertion Depth: Top Entry = (1.40 mm) .055" minimum, Bottom Entry = (2.41 mm) .095" minimum plus board thickness, DH Entry = (2.31 mm) .091" to (2.67 mm) .105"
- Normal Force: 60 grams (0.59 N) average
- Max Cycles: 100 with 10 µ" (0.25 µm) Au
- RoHS Compliant: Yes
- Lead-Free Solderable: Yes
- SMT Lead Coplanarity: (0.10 mm) .004" max (02-35) (0.15 mm) .006" max (36-50)
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Frequently Asked Questions
Where can I buy SAMTEC CLP10302FDBE?
You can click on the BUY or RFQ button to purchase CLP10302FDBE from an authorized SAMTEC distributor.
How do I troubleshoot issues or seek technical support for part CLP10302FDBE?
You can download the CLP10302FDBE datasheet or visit the SAMTEC website for support.
Who is the manufacturer of CLP10302FDBE?
SAMTEC