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SAMTEC CLP10502FDBE Low Profile Dual Wipe Socket
The SAMTEC CLP series is a low-profile dual wipe socket designed for applications requiring high mating cycles and reliable connections. Constructed with a black liquid crystal polymer insulator and phosphor bronze contacts, these sockets offer excellent performance and durability. They are available with gold or tin plating options and are RoHS compliant, making them suitable for a wide range of commercial and industrial applications. The CLP series is ideal for surface mount technology and pass-through applications, providing a secure and reliable connection for various electronic devices.
SAMTEC CLP10502FDBE Low Profile Dual Wipe Socket Specifications:
- Insulator Material: Black Liquid Crystal Polymer
- Contact Material: Phosphor Bronze
- Plating: Sn or Au over 50 µ" (1.27 µm) Ni
- Current Rating: 3.4 A per pin (2 pins powered)
- Voltage Rating: 280 VAC/395 VDC
- Operating Temp Range: -55 °C to +125 °C
- Insertion Depth: Top Entry = (1.40 mm) .055" minimum, Bottom Entry = (2.41 mm) .095" minimum plus board thickness, DH Entry = (2.31 mm) .091" to (2.67 mm) .105"
- Normal Force: 60 grams (0.59 N) average
- Max Cycles: 100 with 10 µ" (0.25 µm) Au
- RoHS Compliant: Yes
- Lead-Free Solderable: Yes
- SMT Lead Coplanarity: (0.10 mm) .004" max (02-35) (0.15 mm) .006" max (36-50)
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Frequently Asked Questions
Where can I buy SAMTEC CLP10502FDBE?
You can click on the BUY or RFQ button to purchase CLP10502FDBE from an authorized SAMTEC distributor.
How do I troubleshoot issues or seek technical support for part CLP10502FDBE?
You can download the CLP10502FDBE datasheet or visit the SAMTEC website for support.
Who is the manufacturer of CLP10502FDBE?
SAMTEC