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SAMTEC CLP10502FDP Low Profile Dual Wipe Socket
The SAMTEC CLP series offers a low-profile dual wipe socket solution for demanding applications requiring high mating cycles and reliable connections. Constructed with phosphor bronze contacts and plated with either gold or tin, these sockets provide excellent conductivity and durability. They are designed for surface mount technology (SMT) and are suitable for pass-through applications. The CLP series is RoHS compliant and operates within a temperature range of -55°C to +125°C, making them ideal for a wide range of industrial and commercial environments. Mates with Tiger Claw connectors.
SAMTEC CLP10502FDP Low Profile Dual Wipe Socket Specifications:
- Insulator Material: Black Liquid Crystal Polymer
- Contact Material: Phosphor Bronze
- Plating: Sn or Au over 50 µ" (1.27 µm) Ni
- Current Rating: 3.4 A per pin (2 pins powered)
- Voltage Rating: 280 VAC/395 VDC
- Operating Temp Range: -55 °C to +125 °C
- Insertion Depth: Top Entry = (1.40 mm) .055" minimum, Bottom Entry = (2.41 mm) .095" minimum plus board thickness, DH Entry = (2.31 mm) .091" to (2.67 mm) .105"
- Normal Force: 60 grams (0.59 N) average
- Max Cycles: 100 with 10 µ" (0.25 µm) Au
- RoHS Compliant: Yes
- Lead-Free Solderable: Yes
- SMT Lead Coplanarity: (0.10 mm) .004" max (02-35) (0.15 mm) .006" max (36-50)
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Frequently Asked Questions
Where can I buy SAMTEC CLP10502FDP?
You can click on the BUY or RFQ button to purchase CLP10502FDP from an authorized SAMTEC distributor.
How do I troubleshoot issues or seek technical support for part CLP10502FDP?
You can download the CLP10502FDP datasheet or visit the SAMTEC website for support.
Who is the manufacturer of CLP10502FDP?
SAMTEC