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SAMTEC CLP10502LDA Low Profile Dual Wipe Socket
The SAMTEC CLP series is a line of low-profile dual wipe sockets engineered for demanding applications requiring high mating cycles and reliable connections. Constructed with a black liquid crystal polymer insulator and phosphor bronze contacts, these sockets offer excellent durability and signal integrity. The gold plating ensures low contact resistance and corrosion resistance, while the robust design accommodates a wide range of operating temperatures. Commonly used in surface mount applications, the CLP series is a versatile solution for various industrial and commercial electronics.
SAMTEC CLP10502LDA Low Profile Dual Wipe Socket Specifications:
- Insulator Material: Black Liquid Crystal Polymer
- Contact Material: Phosphor Bronze
- Plating: Sn or Au over 50 µ" (1.27 µm) Ni
- Current Rating: 3.4 A per pin (2 pins powered)
- Voltage Rating: 280 VAC/395 VDC
- Operating Temp Range: -55 °C to +125 °C
- Insertion Depth: Top Entry = (1.40 mm) .055" minimum, Bottom Entry = (2.41 mm) .095" minimum plus board thickness, DH Entry = (2.31 mm) .091" to (2.67 mm) .105"
- Normal Force: 60 grams (0.59 N) average
- Max Cycles: 100 with 10 µ" (0.25 µm) Au
- RoHS Compliant: Yes
- Lead-Free Solderable: Yes
- SMT Lead Coplanarity: (0.10 mm) .004" max (02-35), (0.15 mm) .006" max (36-50)
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Frequently Asked Questions
Where can I buy SAMTEC CLP10502LDA?
You can click on the BUY or RFQ button to purchase CLP10502LDA from an authorized SAMTEC distributor.
How do I troubleshoot issues or seek technical support for part CLP10502LDA?
You can download the CLP10502LDA datasheet or visit the SAMTEC website for support.
Who is the manufacturer of CLP10502LDA?
SAMTEC