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SAMTEC CLP11002LDP Low Profile Dual Wipe Socket
The SAMTEC CLP series is a low-profile dual wipe socket designed for applications requiring high mating cycles and reliable connections. Constructed with a black liquid crystal polymer insulator and phosphor bronze contacts, these sockets offer excellent performance and durability. They are available with various plating options, including gold and tin, and are suitable for surface mount applications. The CLP series is recognized for its robust design and compatibility with Tiger Claw connectors, making it ideal for pass-through applications and environments demanding high-performance connectivity.
SAMTEC CLP11002LDP Low Profile Dual Wipe Socket Specifications:
- Insulator Material: Black Liquid Crystal Polymer
- Contact Material: Phosphor Bronze
- Plating: Sn or Au over 50 µ" (1.27 µm) Ni
- Current Rating: 3.4 A per pin (2 pins powered)
- Voltage Rating: 280 VAC/395 VDC
- Operating Temp Range: -55 °C to +125 °C
- Insertion Depth: Top Entry = (1.40 mm) .055" minimum, Bottom Entry = (2.41 mm) .095" minimum plus board thickness, DH Entry = (2.31 mm) .091" to (2.67 mm) .105"
- Normal Force: 60 grams (0.59 N) average
- Max Cycles: 100 with 10 µ" (0.25 µm) Au
- RoHS Compliant: Yes
- Lead-Free Solderable: Yes
- SMT Lead Coplanarity: (0.10 mm) .004" max (02-35) (0.15 mm) .006" max (36-50)
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Frequently Asked Questions
Where can I buy SAMTEC CLP11002LDP?
You can click on the BUY or RFQ button to purchase CLP11002LDP from an authorized SAMTEC distributor.
How do I troubleshoot issues or seek technical support for part CLP11002LDP?
You can download the CLP11002LDP datasheet or visit the SAMTEC website for support.
Who is the manufacturer of CLP11002LDP?
SAMTEC